Multiple wavelength sensor emitters

ABSTRACT

A physiological sensor has light emitting sources, each activated by addressing at least one row and at least one column of an electrical grid. The light emitting sources are capable of transmitting light of multiple wavelengths and a detector is responsive to the transmitted light after attenuation by body tissue.

PRIORITY claim

The present application is a continuation of U.S. patent applicationSer. No. 12/422,915, filed Apr. 13, 2009, entitled “Multiple WavelengthSensor Emitters,” which is a continuation of U.S. patent applicationSer. No. 11/367,013, filed Mar. 1, 2006, entitled “Multiple WavelengthSensor Emitters,” which claims priority benefit under 35 U.S.C. §119(e)to U.S. Provisional Patent Application Ser. No. 60/657,596, filed Mar.1, 2005, entitled “Multiple Wavelength Sensor,” No. 60/657,281, filedMar. 1, 2005, entitled “Physiological Parameter Confidence Measure,” No.60/657,268, filed Mar. 1, 2005, entitled “Configurable PhysiologicalMeasurement System,” and No. 60/657,759, filed Mar. 1, 2005, entitled“Noninvasive Multi-Parameter Patient Monitor.” The present applicationincorporates the foregoing disclosures herein by reference in theirentirety.

INCORPORATION BY REFERENCE OF RELATED APPLICATIONS

The present application is related to the following U.S. utilityapplications:

App. Sr. No. Filing Date Title Atty Dock. 1 11/367,013 Mar. 1, 2006Multiple MLR.002A Wavelength Sensor Emitters 11/546,932 Oct. 12, 2006Disposable MLR.002CP1 Wavelength Optical Sensor 2 11/366,995 Mar. 1,2006 Multiple MLR.003A Wavelength Sensor Equalization 3 11/366,209 Mar.1, 2006 Multiple MLR.004A Wavelength Sensor Substrate 4 11/366,210 Mar.1, 2006 Multiple MLR.005A Wavelength Sensor Interconnect 5 11/366,833Mar. 1, 2006 Multiple MLR.006A Wavelength Sensor Attachment 6 11/366,997Mar. 1, 2006 Multiple MLR.009A Wavelength Sensor Drivers 7 11/367,034Mar. 1, 2006 Physiological MLR.010A Parameter Confidence Measure 811/367,036 Mar. 1, 2006 Configurable MLR.011A Physiological MeasurementSystem 9 11/367,033 Mar. 1, 2006 Noninvasive MLR.012A Multi-ParameterPatient Monitor 10 11/367,014 Mar. 1, 2006 Noninvasive MLR.013AMulti-Parameter Patient Monitor 11 11/366,208 Mar. 1, 2006 NoninvasiveMLR.014A Multi-Parameter Patient Monitor 12 12/056,179 Mar. 26, 2008Multiple MLR.015A Wavelength Optical Sensor 13 12/082,810 Apr. 14, 2008Optical Sensor MLR.015A2 AssemblyThe present application incorporates the foregoing disclosures herein byreference.

BACKGROUND

Spectroscopy is a common technique for measuring the concentration oforganic and some inorganic constituents of a solution. The theoreticalbasis of this technique is the Beer-Lambert law, which states that theconcentration c_(i) of an absorbent in solution can be determined by theintensity of light transmitted through the solution, knowing thepathlength d_(λ), the intensity of the incident light I_(s1), and theextinction coefficient ε_(1,λ) at a particular wavelength λ. Ingeneralized form, the Beer-Lambert law is expressed as:

$\begin{matrix}{I_{\lambda} = {I_{0,\lambda}^{{- d_{\lambda}} \cdot \mu_{a,\lambda}}}} & (1) \\{\mu_{a,\lambda} = {\sum\limits_{i = 1}^{n}{ɛ_{i,\lambda} \cdot c_{i}}}} & (2)\end{matrix}$

where μ_(a,λ) is the bulk absorption coefficient and represents theprobability of absorption per unit length. The minimum number ofdiscrete wavelengths that are required to solve EQS. 1-2 are the numberof significant absorbers that are present in the solution.

A practical application of this technique is pulse oximetry, whichutilizes a noninvasive sensor to measure oxygen saturation (SpO₂) andpulse rate. In general, the sensor has light emitting diodes (LEDs) thattransmit optical radiation of red and infrared wavelengths into a tissuesite and a detector that responds to the intensity of the opticalradiation after absorption (e.g., by transmission or transreflectance)by pulsatile arterial blood flowing within the tissue site. Based onthis response, a processor determines measurements for SpO₂, pulse rate,and can output representative plethysmographic waveforms. Thus, “pulseoximetry” as used herein encompasses its broad ordinary meaning known toone of skill in the art, which includes at least those noninvasiveprocedures for measuring parameters of circulating blood throughspectroscopy. Moreover, “plethysmograph” as used herein (commonlyreferred to as “photoplethysmograph”), encompasses its broad ordinarymeaning known to one of skill in the art, which includes at least datarepresentative of a change in the absorption of particular wavelengthsof light as a function of the changes in body tissue resulting frompulsing blood. Pulse oximeters capable of reading through motion inducednoise are available from Masimo Corporation (“Masimo”) of Irvine, Calif.Moreover, portable and other oximeters capable of reading through motioninduced noise are disclosed in at least U.S. Pat. Nos. 6,770,028,6,658,276, 6,157,850, 6,002,952, 5,769,785, and 5,758,644, which areowned by Masimo and are incorporated by reference herein. Such readingthrough motion oximeters have gained rapid acceptance in a wide varietyof medical applications, including surgical wards, intensive care andneonatal units, general wards, home care, physical training, andvirtually all types of monitoring scenarios.

SUMMARY

There is a need to noninvasively measure multiple physiologicalparameters, other than, or in addition to, oxygen saturation and pulserate. For example, hemoglobin species that are also significant undercertain circumstances are carboxyhemoglobin and methemoglobin. Otherblood parameters that may be measured to provide important clinicalinformation are fractional oxygen saturation, total hemaglobin (Hbt),bilirubin and blood glucose, to name a few.

One aspect of a physiological sensor is light emitting sources, eachactivated by addressing at least one row and at least one column of anelectrical grid. The light emitting sources transmit light havingmultiple wavelengths and a detector is responsive to the transmittedlight after attenuation by body tissue.

Another aspect of a physiological sensor is light emitting sourcescapable of transmitting light having multiple wavelengths. Each of thelight emitting sources includes a first contact and a second contact.The first contacts of a first set of the light emitting sources are incommunication with a first conductor and the second contacts of a secondset of the light emitting sources are in communication with a secondconductor. A detector is capable of detecting the transmitted lightattenuated by body tissue and outputting a signal indicative of at leastone physiological parameter of the body tissue. At least one lightemitting source of the first set and at least one light emitting sourceof the second set are not common to the first and second sets. Further,each of the first set and the second set comprises at least two of thelight emitting sources.

A further aspect of a physiological sensor sequentially addresses lightemitting sources using conductors of an electrical grid so as to emitlight having multiple wavelengths that when attenuated by body tissue isindicative of at least one physiological characteristic. The emittedlight is detected after attenuation by body tissue.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a physiological measurement systemutilizing a multiple wavelength sensor;

FIGS. 2A-C are perspective views of multiple wavelength sensorembodiments;

FIG. 3 is a general block diagram of a multiple wavelength sensor andsensor controller;

FIG. 4 is an exploded perspective view of a multiple wavelength sensorembodiment;

FIG. 5 is a general block diagram of an emitter assembly;

FIG. 6 is a perspective view of an emitter assembly embodiment;

FIG. 7 is a general block diagram of an emitter array;

FIG. 8 is a schematic diagram of an emitter array embodiment;

FIG. 9 is a general block diagram of equalization;

FIGS. 10A-D are block diagrams of various equalization embodiments;

FIGS. 11A-C are perspective views of an emitter assembly incorporatingvarious equalization embodiments;

FIG. 12 is a general block diagram of an emitter substrate;

FIGS. 13-14 are top and detailed side views of an emitter substrateembodiment;

FIG. 15-16 are top and bottom component layout views of an emittersubstrate embodiment;

FIG. 17 is a schematic diagram of an emitter substrate embodiment;

FIG. 18 is a plan view of an inner layer of an emitter substrateembodiment;

FIG. 19 is a general block diagram of an interconnect assembly inrelationship to other sensor assemblies;

FIG. 20 is a block diagram of an interconnect assembly embodiment;

FIG. 21 is a partially-exploded perspective view of a flex circuitassembly embodiment of an interconnect assembly;

FIG. 22 is a top plan view of a flex circuit;

FIG. 23 is an exploded perspective view of an emitter portion of a flexcircuit assembly;

FIG. 24 is an exploded perspective view of a detector assemblyembodiment;

FIGS. 25-26 are block diagrams of adjacent detector and stacked detectorembodiments;

FIG. 27 is a block diagram of a finger clip embodiment of an attachmentassembly;

FIG. 28 is a general block diagram of a detector pad;

FIGS. 29A-B are perspective views of detector pad embodiments;

FIGS. 30A-H are perspective bottom, perspective top, bottom, back, top,side cross sectional, side, and front cross sectional views of anemitter pad embodiment;

FIGS. 31A-H are perspective bottom, perspective top, top, back, bottom,side cross sectional, side, and front cross sectional views of adetector pad embodiment;

FIGS. 32A-H are perspective bottom, perspective top, top, back, bottom,side cross sectional, side, and front cross sectional views of a shoebox;

FIGS. 33A-H are perspective bottom, perspective top, top, back, bottom,side cross sectional, side, and front cross sectional views of aslim-finger emitter pad embodiment;

FIGS. 34A-H are perspective bottom, perspective top, top, back, bottom,side cross sectional, side, and front cross sectional views of aslim-finger detector pad embodiment;

FIGS. 35A-B are plan and cross sectional views, respectively, of aspring assembly embodiment;

FIGS. 36A-C are top, perspective and side views of a finger clip spring;

FIGS. 37A-D are top, back, bottom, and side views of a spring plate;

FIGS. 38A-D are front cross sectional, bottom, front and side crosssectional views of an emitter-pad shell;

FIGS. 39A-D are back, top, front and side cross sectional views of adetector-pad shell;

FIG. 40 is a general block diagram of a monitor and a sensor;

FIGS. 41A-C are schematic diagrams of grid drive embodiments for asensor having back-to-back diodes and an information element;

FIG. 42 is a schematic diagrams of a grid drive embodiment for aninformation element;

FIGS. 43A-C are schematic diagrams for grid drive readable informationelements;

FIGS. 44A-B are cross sectional and side cut away views of a sensorcable;

FIG. 45 is a block diagram of a sensor controller embodiment; and

FIG. 46 is a detailed exploded perspective view of a multiple wavelengthsensor embodiment.

DETAILED DESCRIPTION Overview

In this application, reference is made to many blood parameters. Somereferences that have common shorthand designations are referencedthrough such shorthand designations. For example, as used herein, HbCOdesignates carboxyhemoglobin, HbMet designates methemoglobin, and Hbtdesignates total hemoglobin. Other shorthand designations such as COHb,MetHb, and tHb are also common in the art for these same constituents.These constituents are generally reported in terms of a percentage,often referred to as saturation, relative concentration or fractionalsaturation. Total hemoglobin is generally reported as a concentration ing/dL. The use of the particular shorthand designators presented in thisapplication does not restrict the term to any particular manner in whichthe designated constituent is reported.

FIG. 1 illustrates a physiological measurement system 10 having amonitor 100 and a multiple wavelength sensor assembly 200 with enhancedmeasurement capabilities as compared with conventional pulse oximetry.The physiological measurement system 10 allows the monitoring of aperson, including a patient. In particular, the multiple wavelengthsensor assembly 200 allows the measurement of blood constituent andrelated parameters in addition to oxygen saturation and pulse rate.Alternatively, the multiple wavelength sensor assembly 200 allows themeasurement of oxygen saturation and pulse rate with increased accuracyor robustness as compared with conventional pulse oximetry.

In one embodiment, the sensor assembly 200 is configured to plug into amonitor sensor port 110. Monitor keys 160 provide control over operatingmodes and alarms, to name a few. A display 170 provides readouts ofmeasured parameters, such as oxygen saturation, pulse rate, HbCO andHbMet to name a few.

FIG. 2A illustrates a multiple wavelength sensor assembly 200 having asensor 400 adapted to attach to a tissue site, a sensor cable 4400 and amonitor connector 210. In one embodiment, the sensor 400 is incorporatedinto a reusable finger clip adapted to removably attach to, and transmitlight through, a fingertip. The sensor cable 4400 and monitor connector210 are integral to the sensor 400, as shown. In alternativeembodiments, the sensor 400 may be configured separately from the cable4400 and connector 210.

FIGS. 2B-C illustrate alternative sensor embodiments, including a sensor401 (FIG. 2B) partially disposable and partially reusable (resposable)and utilizing an adhesive attachment mechanism. Also shown is a sensor402 (FIG. 2C) being disposable and utilizing an adhesive attachmentmechanism. In other embodiments, a sensor may be configured to attach tovarious tissue sites other than a finger, such as a foot or an ear. Alsoa sensor may be configured as a reflectance or transflectance devicethat attaches to a forehead or other tissue surface.

FIG. 3 illustrates a sensor assembly 400 having an emitter assembly 500,a detector assembly 2400, an interconnect assembly 1900 and anattachment assembly 2700. The emitter assembly 500 responds to drivesignals received from a sensor controller 4500 in the monitor 100 viathe cable 4400 so as to transmit optical radiation having a plurality ofwavelengths into a tissue site. The detector assembly 2400 provides asensor signal to the monitor 100 via the cable 4400 in response tooptical radiation received after attenuation by the tissue site. Theinterconnect assembly 1900 provides electrical communication between thecable 4400 and both the emitter assembly 500 and the detector assembly2400. The attachment assembly 2700 attaches the emitter assembly 500 anddetector assembly 2400 to a tissue site, as described above. The emitterassembly 500 is described in further detail with respect to FIG. 5,below. The interconnect assembly 1900 is described in further detailwith respect to FIG. 19, below. The detector assembly 2400 is describedin further detail with respect to FIG. 24, below. The attachmentassembly 2700 is described in further detail with respect to FIG. 27,below.

FIG. 4 illustrates a sensor 400 embodiment that removably attaches to afingertip. The sensor 400 houses a multiple wavelength emitter assembly500 and corresponding detector assembly 2400. A flex circuit assembly1900 mounts the emitter and detector assemblies 500, 2400 andinterconnects them to a multi-wire sensor cable 4400. Advantageously,the sensor 400 is configured in several respects for both wearer comfortand parameter measurement performance. The flex circuit assembly 1900 isconfigured to mechanically decouple the cable 4400 wires from theemitter and detector assemblies 500, 2400 to reduce pad stiffness andwearer discomfort. The pads 3000, 3100 are mechanically decoupled fromshells 3800, 3900 to increase flexibility and wearer comfort. A spring3600 is configured in hinged shells 3800, 3900 so that the pivot pointof the finger clip is well behind the fingertip, improving fingerattachment and more evenly distributing the clip pressure along thefinger.

As shown in FIG. 4, the detector pad 3100 is structured to properlyposition a fingertip in relationship to the detector assembly 2400. Thepads have flaps that block ambient light. The detector assembly 2400 ishoused in an enclosure so as to reduce light piping from the emitterassembly to the detector assembly without passing through fingertiptissue. These and other features are described in detail below.Specifically, emitter assembly embodiments are described with respect toFIGS. 5-18. Interconnect assembly embodiments, including the flexiblecircuit assembly 1900, are described with respect to FIGS. 19-23.Detector assembly embodiments are described with respect to FIGS. 24-26.Attachment assembly embodiments are described with respect to FIGS.27-39.

Emitter Assembly

FIG. 5 illustrates an emitter assembly 500 having an emitter array 700,a substrate 1200 and equalization 900. The emitter array 700 hasmultiple light emitting sources, each activated by addressing at leastone row and at least one column of an electrical grid. The lightemitting sources are capable of transmitting optical radiation havingmultiple wavelengths. The equalization 900 accounts for differences intissue attenuation of the optical radiation across the multiplewavelengths so as to at least reduce wavelength-dependent variations indetected intensity. The substrate 1200 provides a physical mount for theemitter array and emitter-related equalization and a connection betweenthe emitter array and the interconnection assembly. Advantageously, thesubstrate 1200 also provides a bulk temperature measurement so as tocalculate the operating wavelengths for the light emitting sources. Theemitter array 700 is described in further detail with respect to FIG. 7,below. Equalization is described in further detail with respect to FIG.9, below. The substrate 1200 is described in further detail with respectto FIG. 12, below.

FIG. 6 illustrates an emitter assembly 500 embodiment having an emitterarray 700, an encapsulant 600, an optical filter 1100 and a substrate1200. Various aspects of the emitter assembly 500 are described withrespect to FIGS. 7-18, below. The emitter array 700 emits opticalradiation having multiple wavelengths of predetermined nominal values,advantageously allowing multiple parameter measurements. In particular,the emitter array 700 has multiple light emitting diodes (LEDs) 710 thatare physically arranged and electrically connected in an electrical gridto facilitate drive control, equalization, and minimization of opticalpathlength differences at particular wavelengths. The optical filter1100 is advantageously configured to provide intensity equalizationacross a specific LED subset. The substrate 1200 is configured toprovide a bulk temperature of the emitter array 700 so as to betterdetermine LED operating wavelengths.

Emitter Array

FIG. 7 illustrates an emitter array 700 having multiple light emitters(LE) 710 capable of emitting light 702 having multiple wavelengths intoa tissue site 1. Row drivers 4530 and column drivers 4560 areelectrically connected to the light emitters 710 and activate one ormore light emitters 710 by addressing at least one row 720 and at leastone column 740 of an electrical grid. In one embodiment, the lightemitters 710 each include a first contact 712 and a second contact 714.The first contact 712 of a first subset 730 of light emitters is incommunication with a first conductor 720 of the electrical grid. Thesecond contact 714 of a second subset 750 of light emitters is incommunication with a second conductor 740. Each subset comprises atleast two light emitters, and at least one of the light emitters of thefirst and second subsets 730, 750 are not in common. A detector 2400 iscapable of detecting the emitted light 702 and outputting a sensorsignal 2500 responsive to the emitted light 702 after attenuation by thetissue site 1. As such, the sensor signal 2500 is indicative of at leastone physiological parameter corresponding to the tissue site 1, asdescribed above.

FIG. 8 illustrates an emitter array 700 having LEDs 801 connected withinan electrical grid of n rows and m columns totaling n m drive lines4501, 4502, where n and m integers greater than one. The electrical gridadvantageously minimizes the number of drive lines required to activatethe LEDs 801 while preserving flexibility to selectively activateindividual LEDs 801 in any sequence and multiple LEDs 801simultaneously. The electrical grid also facilitates setting LEDcurrents so as to control intensity at each wavelength, determiningoperating wavelengths and monitoring total grid current so as to limitpower dissipation. The emitter array 700 is also physically configuredin rows 810. This physical organization facilitates clustering LEDs 801according to wavelength so as to minimize pathlength variations andfacilitates equalization of LED intensities.

As shown in FIG. 8, one embodiment of an emitter array 700 comprises upto sixteen LEDs 801 configured in an electrical grid of four rows 810and four columns 820. Each of the four row drive lines 4501 provide acommon anode connection to four LEDs 801, and each of the four columndrive lines 4502 provide a common cathode connection to four LEDs 801.Thus, the sixteen LEDs 801 are advantageously driven with only eightwires, including four anode drive lines 812 and four cathode drive lines822. This compares favorably to conventional common anode or cathode LEDconfigurations, which require more drive lines. In a particularembodiment, the emitter array 700 is partially populated with eight LEDshaving nominal wavelengths as shown in TABLE 1. Further, LEDs havingwavelengths in the range of 610-630 nm are grouped together in the samerow. The emitter array 700 is adapted to a physiological measurementsystem 10 (FIG. 1) for measuring H_(b)CO and/or METHb in addition to SO₂and pulse rate.

TABLE 1 Nominal LED Wavelengths LED λ Row Col D1 630 1 1 D2 620 1 2 D3610 1 3 D4 1 4 D5 700 2 1 D6 730 2 2 D7 660 2 3 D8 805 2 4 D9 3 1 D10 32 D11 3 3 D12 905 3 4 D13 4 1 D14 4 2 D15 4 3 D16 4 4

Also shown in FIG. 8, row drivers 4530 and column drivers 4560 locatedin the monitor 100 selectively activate the LEDs 801. In particular, rowand column drivers 4530, 4560 function together as switches to Vcc andcurrent sinks, respectively, to activate LEDs and as switches to groundand Vcc, respectively, to deactivate LEDs. This push-pull driveconfiguration advantageously prevents parasitic current flow indeactivated LEDs. In a particular embodiment, only one row drive line4501 is switched to Vcc at a time. One to four column drive lines 4502,however, can be simultaneously switched to a current sink so as tosimultaneously activate multiple LEDs within a particular row.Activation of two or more LEDs of the same wavelength facilitatesintensity equalization, as described with respect to FIGS. 9-11, below.LED drivers are described in further detail with respect to FIG. 45,below.

Although an emitter assembly is described above with respect to an arrayof light emitters each configured to transmit optical radiation centeredaround a nominal wavelength, in another embodiment, an emitter assemblyadvantageously utilizes one or more tunable broadband light sources,including the use of filters to select the wavelength, so as to minimizewavelength-dependent pathlength differences from emitter to detector. Inyet another emitter assembly embodiment, optical radiation from multipleemitters each configured to transmit optical radiation centered around anominal wavelength is funneled to a tissue site point so as to minimizewavelength-dependent pathlength differences. This funneling may beaccomplish with fiberoptics or mirrors, for example. In furtherembodiments, the LEDs 801 can be configured with alternativeorientations with correspondingly different drivers among various otherconfigurations of LEDs, drivers and interconnecting conductors.

Equalization

FIG. 9 illustrate a physiological parameter measurement system 10 havinga controller 4500, an emitter assembly 500, a detector assembly 2400 anda front-end 4030. The emitter assembly 500 is configured to transmitoptical radiation having multiple wavelengths into the tissue site 1.The detector assembly 2400 is configured to generate a sensor signal2500 responsive to the optical radiation after tissue attenuation. Thefront-end 4030 conditions the sensor signal 2500 prior toanalog-to-digital conversion (ADC).

FIG. 9 also generally illustrates equalization 900 in a physiologicalmeasurement system 10 operating on a tissue site 1. Equalizationencompasses features incorporated into the system 10 in order to providea sensor signal 2500 that falls well within the dynamic range of the ADCacross the entire spectrum of emitter wavelengths. In particular,equalization compensates for the imbalance in tissue light absorptiondue to Hb and HbO₂ 910. Specifically, these blood constituents attenuatered wavelengths greater than IR wavelengths. Ideally, equalization 900balances this unequal attenuation. Equalization 900 can be introducedanywhere in the system 10 from the controller 4500 to front-end 4000 andcan include compensatory attenuation versus wavelength, as shown, orcompensatory amplification versus or both.

Equalization can be achieved to a limited extent by adjusting drivecurrents from the controller 4500 and front-end 4030 amplificationaccordingly to wavelength so as to compensate for tissue absorptioncharacteristics. Signal demodulation constraints, however, limit themagnitude of these adjustments. Advantageously, equalization 900 is alsoprovided along the optical path from emitters 500 to detector 2400.Equalization embodiments are described in further detail with respect toFIGS. 10-11, below.

FIGS. 10A-D illustrate various equalization embodiments having anemitter array 700 adapted to transmit optical radiation into a tissuesite 1 and a detector assembly 2400 adapted to generate a sensor signal2500 responsive to the optical radiation after tissue attenuation. FIG.10A illustrates an optical filter 1100 that attenuates at least aportion of the optical radiation before it is transmitted into a tissuesite 1. In particular, the optical filter 1100 attenuates at least aportion of the IR wavelength spectrum of the optical radiation so as toapproximate an equalization curve 900 (FIG. 9). FIG. 10B illustrates anoptical filter 1100 that attenuates at least a portion of the opticalradiation after it is attenuated by a tissue site 1, where the opticalfilter 1100 approximates an equalization curve 900 (FIG. 9).

FIG. 10C illustrates an emitter array 700 where at least a portion ofthe emitter array generates one or more wavelengths from multiple lightemitters 710 of the same wavelength. In particular, the same-wavelengthlight emitters 710 boost at least a portion of the red wavelengthspectrum so as to approximately equalize the attenuation curves 910(FIG. 9), FIG. 10D illustrates a detector assembly 2400 having multipledetectors 2610, 2620 selected so as to equalize the attenuation curves910 (FIG. 9). To a limited extent, optical equalization can also beachieved by selection of particular emitter array 700 and detector 2400components, e.g. LEDs having higher output intensities or detectorshaving higher sensitivities at red wavelengths. Although equalizationembodiments are described above with respect to red and IR wavelengths,these equalization embodiments can be applied to equalize tissuecharacteristics across any portion of the optical spectrum.

FIGS. 11A-C illustrates an optical filter 1100 for an emitter assembly500 that advantageously provides optical equalization, as describedabove, LEDs within the emitter array 700 may be grouped according tooutput intensity or wavelength or both. Such a grouping facilitatesequalization of LED intensity across the array. In particular,relatively low tissue absorption and/or relatively high output intensityLEDs can be grouped together under a relatively high attenuation opticalfilter. Likewise, relatively low tissue absorption and/or relatively lowoutput intensity LEDs can be grouped together without an optical filteror under a relatively low or negligible attenuation optical filter.Further, high tissue absorption and/or low intensity LEDs can be groupedwithin the same row with one or more LEDs of the same wavelength beingsimultaneously activated, as described with respect to FIG. 10C, above.In general, there can be any number of LED groups and any number of LEDswithin a group. There can also be any number of optical filterscorresponding to the groups having a range of attenuation, including nooptical filter and/or a “clear” filter having negligible attenuation.

As shown in FIGS. 11A-C, a filtering media may be advantageously addedto an encapsulant that functions both as a cover to protect LEDs andbonding wires and as an optical filter 1100. In one embodiment, afiltering media 1100 encapsulates a select group of LEDs and a clearmedia 600 (FIG. 6) encapsulates the entire array 700 and the filteringmedia 1000 (FIG. 6). In a particular embodiment, corresponding to TABLE1, above, five LEDs nominally emitting at 660-905 nm are encapsulatedwith both a filtering media 1100 and an overlying clear media 600 (FIG.6), i.e. attenuated. In a particular embodiment, the filtering media1100 is a 40:1 mixture of a clear encapsulant (EPO-TEK OG147-7) and anopaque encapsulate (EPO-TEK OG147) both available from Epoxy Technology,Inc., Billerica, Mass. Three LEDs nominally emitting at 610-630 nm areonly encapsulated with the clear media 600 (FIG. 6), i.e. unattenuated.In alternative embodiments, individual LEDs may be singly or multiplyencapsulated according to tissue absorption and/or output intensity. Inother alternative embodiments, filtering media may be separatelyattachable optical filters or a combination of encapsulants andseparately attachable optical filters. In a particular embodiment, theemitter assembly 500 has one or more notches along each side proximatethe component end 1305 (FIG. 13) for retaining one or more clip-onoptical filters.

Substrate

FIG. 12 illustrates light emitters 710 configured to transmit opticalradiation 1201 having multiple wavelengths in response to correspondingdrive currents 1210. A thermal mass 1220 is disposed proximate theemitters 710 so as to stabilize a bulk temperature 1202 for theemitters. A temperature sensor 1230 is thermally coupled to the thermalmass 1220, wherein the temperature sensor 1230 provides a temperaturesensor output 1232 responsive to the bulk temperature 1202 so that thewavelengths are determinable as a function of the drive currents 1210and the bulk temperature 1202.

In one embodiment, an operating wavelength λ_(a) of each light emitter710 is determined according to EQ. 3

λ_(a) =f(T _(b) ,I _(drive) ,ΣI _(drive))  (3)

where T_(b) is the bulk temperature, I_(drive) is the drive current fora particular light emitter, as determined by the sensor controller 4500(FIG. 45), described below, and ΣI_(drive) is the total drive currentfor all light emitters. In another embodiment, temperature sensors areconfigured to measure the temperature of each light emitter 710 and anoperating wavelength λ_(a) of each light emitter 710 is determinedaccording to EQ. 4

λ_(a) =f(T _(a) ,I _(drive) ,ΣI _(drive))  (4)

where T_(a) is the temperature of a particular light emitter, I_(drive)is the drive current for that light emitter and ΣI_(drive) is the totaldrive current for all light emitters.

In yet another embodiment, an operating wavelength for each lightemitter is determined by measuring the junction voltage for each lightemitter 710. In a further embodiment, the temperature of each lightemitter 710 is controlled, such as by one or more Peltier cells coupledto each light emitter 710, and an operating wavelength for each lightemitter 710 is determined as a function of the resulting controlledtemperature or temperatures. In other embodiments, the operatingwavelength for each light emitter 710 is determined directly, forexample by attaching a charge coupled device (CCD) to each light emitteror by attaching a fiberoptic to each light emitter and coupling thefiberoptics to a wavelength measuring device, to name a few.

FIGS. 13-18 illustrate one embodiment of a substrate 1200 configured toprovide thermal conductivity between an emitter array 700 (FIG. 8) and athermistor 1540 (FIG. 16). In this manner, the resistance of thethermistor 1540 (FIG. 16) can be measured in order to determine the bulktemperature of LEDs 801 (FIG. 8) mounted on the substrate 1200. Thesubstrate 1200 is also configured with a relatively significant thermalmass, which stabilizes and normalizes the bulk temperature so that thethermistor measurement of bulk temperature is meaningful.

FIGS. 13-14 illustrate a substrate 1200 having a component side 1301, asolder side 1302, a component end 1305 and a connector end 1306.Alignment notches 1310 are disposed between the ends 1305, 1306. Thesubstrate 1200 further has a component layer 1401, inner layers1402-1405 and a solder layer 1406. The inner layers 1402-1405, e.g.inner layer 1402 (FIG. 18), have substantial metallized areas 1411 thatprovide a thermal mass 1220 (FIG. 12) to stabilize a bulk temperaturefor the emitter array 700 (FIG. 12). The metallized areas 1411 alsofunction to interconnect component pads 1510 and wire bond pads 1520(FIG. 15) to the connector 1530.

FIGS. 15-16 illustrate a substrate 1200 having component pads 1510 andwire bond pads 1520 at a component end 1305. The component pads 1510mount and electrically connect a first side (anode or cathode) of theLEDs 801 (FIG. 8) to the substrate 1200. Wire bond pads 1520electrically connect a second side (cathode or anode) of the LEDs 801(FIG. 8) to the substrate 1200. The connector end 1306 has a connector1530 with connector pads 1532, 1534 that mount and electrically connectthe emitter assembly 500 (FIG. 23), including the substrate 1200, to theflex circuit 2200 (FIG. 22). Substrate layers 1401-1406 (FIG. 14) havetraces that electrically connect the component pads 1510 and wire bondpads 1520 to the connector 1532-1534. A thermistor 1540 is mounted tothermistor pads 1550 at the component end 1305, which are alsoelectrically connected with traces to the connector 1530. Plated thruholes electrically connect the connector pads 1532, 1534 on thecomponent and solder sides 1301, 1302, respectively.

FIG. 17 illustrates the electrical layout of a substrate 1200. A portionof the LEDs 801, including D1-D4 and D13-D16 have cathodes physicallyand electrically connected to component pads 1510 (FIG. 15) andcorresponding anodes wire bonded to wire bond pads 1520. Another portionof the LEDs 801, including D5-D8 and D9-D12, have anodes physically andelectrically connected to component pads 1510 (FIG. 15) andcorresponding cathodes wire bonded to wire bond pads 1520. The connector1530 has row pinouts J21-J24, column pinouts J31-J34 and thermistorpinouts J40-J41 for the LEDs 801 and thermistor 1540.

Interconnect Assembly

FIG. 19 illustrates an interconnect assembly 1900 that mounts theemitter assembly 500 and detector assembly 2400, connects to the sensorcable 4400 and provides electrical communications between the cable andeach of the emitter assembly 500 and detector assembly 2400. In oneembodiment, the interconnect assembly 1900 is incorporated with theattachment assembly 2700, which holds the emitter and detectorassemblies to a tissue site. An interconnect assembly embodimentutilizing a flexible (flex) circuit is described with respect to FIGS.20-24, below.

FIG. 20 illustrates an interconnect assembly 1900 embodiment having acircuit substrate 2200, an emitter mount 2210, a detector mount 2220 anda cable connector 2230. The emitter mount 2210, detector mount 2220 andcable connector 2230 are disposed on the circuit substrate 2200. Theemitter mount 2210 is adapted to mount an emitter assembly 500 havingmultiple emitters. The detector mount 2220 is adapted to mount adetector assembly 2400 having a detector. The cable connector 2230 isadapted to attach a sensor cable 4400. A first plurality of conductors2040 disposed on the circuit substrate 2200 electrically interconnectsthe emitter mount 2210 and the cable connector 2230. A second pluralityof conductors 2050 disposed on the circuit substrate 2200 electricallyinterconnects the detector mount 2220 and the cable connector 2230. Adecoupling 2060 disposed proximate the cable connector 2230substantially mechanically isolates the cable connector 2230 from boththe emitter mount 2210 and the detector mount 2220 so that sensor cablestiffness is not translated to the emitter assembly 500 or the detectorassembly 2400. A shield 2070 is adapted to fold over and shield one ormore wires or pairs of wires of the sensor cable 4400.

FIG. 21 illustrates a flex circuit assembly 1900 having a flex circuit2200, an emitter assembly 500 and a detector assembly 2400, which isconfigured to terminate the sensor end of a sensor cable 4400. The flexcircuit assembly 1900 advantageously provides a structure thatelectrically connects yet mechanically isolates the sensor cable 4400,the emitter assembly 500 and the detector assembly 2400. As a result,the mechanical stiffness of the sensor cable 4400 is not translated tothe sensor pads 3000, 3100 (FIGS. 30-31), allowing a comfortable fingerattachment for the sensor 200 (FIG. 1). In particular, the emitterassembly 500 and detector assembly 2400 are mounted to opposite ends2201, 2202 (FIG. 22) of an elongated flex circuit 2200. The sensor cable4400 is mounted to a cable connector 2230 extending from a middleportion of the flex circuit 2200. Detector wires 4470 are shielded atthe flex circuit junction by a fold-over conductive ink flap 2240, whichis connected to a cable inner shield 4450. The flex circuit 2200 isdescribed in further detail with respect to FIG. 22. The emitter portionof the flex circuit assembly 1900 is described in further detail withrespect to FIG. 23. The detector assembly 2400 is described with respectto FIG. 24. The sensor cable 4400 is described with respect to FIGS.44A-B, below.

FIG. 22 illustrates a sensor flex circuit 2200 having an emitter end2201, a detector end 2202, an elongated interconnect 2204, 2206 betweenthe ends 2201, 2202 and a cable connector 2230 extending from theinterconnect 2204, 2206. The emitter end 2201 forms a “head” havingemitter solder pads 2210 for attaching the emitter assembly 500 (FIG. 6)and mounting ears 2214 for attaching to the emitter pad 3000 (FIG. 30B),as described below. The detector end 2202 has detector solder pads forattaching the detector 2410 (FIG. 24). The interconnect 2204 between theemitter end 2201 and the cable connector 2230 forms a “neck,” and theinterconnect 2206 between the detector end 2202 and the cable connector2230 forms a “tail.” The cable connector 2230 forms “wings” that extendfrom the interconnect 2204, 2206 between the neck 2204 and tail 2206. Aconductive ink flap 2240 connects to the cable inner shield 4450 (FIGS.44A-B) and folds over to shield the detector wires 4470 (FIGS. 44A-B)soldered to the detector wire pads 2236. The outer wire pads 2238connect to the remaining cable wires 4430 (FIGS. 44A-B). The flexcircuit 2200 has top coverlay, top ink, inner coverlay, trace, tracebase, bottom ink and bottom coverlay layers.

The flex circuit 2200 advantageously provides a connection between amultiple wire sensor cable 4400 (FIGS. 44A-B), a multiple wavelengthemitter assembly 500 (FIG. 6) and a detector assembly 2400 (FIG. 24)without rendering the emitter and detector assemblies unwieldy andstiff. In particular, the wings 2230 provide a relatively large solderpad area 2232 that is narrowed at the neck 2204 and tail 2206 tomechanically isolate the cable 4400 (FIGS. 44A-B) from the remainder ofthe flex circuit 2200. Further, the neck 2206 is folded (see FIG. 4) forinstallation in the emitter pad 3000 (FIGS. 30A-H) and acts as aflexible spring to further mechanically isolate the cable 4400 (FIGS.44A-B) from the emitter assembly 500 (FIG. 4). The tail 2206 provides anintegrated connectivity path between the detector assembly 2400 (FIG.24) mounted in the detector pad 3100 (FIGS. 31A-H) and the cableconnector 2230 mounted in the opposite emitter pad 3000 (FIGS. 30A-H).

FIG. 23 illustrates the emitter portion of the flex circuit assembly1900 (FIG. 21) having the emitter assembly 500. The emitter assemblyconnector 1530 is attached to the emitter end 2210 of the flex circuit2200 (FIG. 22). In particular, reflow solder 2330 connects thru holepads 1532, 1534 of the emitter assembly 500 to corresponding emitterpads 2310 of the flex circuit 2200 (FIG. 22).

FIG. 24 illustrates a detector assembly 2400 including a detector 2410,solder pads 2420, copper mesh tape 2430, an EMI shield 2440 and foil2450. The detector 2410 is soldered 2460 chip side down to detectorsolder pads 2420 of the flex circuit 2200. The detector solder joint anddetector ground pads 2420 are wrapped with the Kapton tape 2470. EMIshield tabs 2442 are folded onto the detector pads 2420 and soldered.The EMI shield walls are folded around the detector 2410 and theremaining tabs 2442 are soldered to the back of the EMI shield 2440. Thecopper mesh tape 2430 is cut to size and the shielded detector and flexcircuit solder joint are wrapped with the copper mesh tape 2430. Thefoil 2450 is cut to size with a predetermined aperture 2452. The foil2450 is wrapped around shielded detector with the foil side in and theaperture 2452 is aligned with the EMI shield grid 2444.

Detector Assembly

FIG. 25 illustrates an alternative detector assembly 2400 embodimenthaving adjacent detectors. Optical radiation having multiple wavelengthsgenerated by emitters 700 is transmitted into a tissue site 1. Opticalradiation at a first set of wavelengths is detected by a first detector2510, such as, for example, a Si detector. Optical radiation at a secondset of wavelengths is detected by a second detector 2520, such as, forexample, a GaAs detector.

FIG. 26 illustrates another alternative detector assembly 2400embodiment having stacked detectors coaxial along a light path. Opticalradiation having multiple wavelengths generated by emitters 700 istransmitted into a tissue site 1. Optical radiation at a first set ofwavelengths is detected by a first detector 2610. Optical radiation at asecond set of wavelengths passes through the first detector 2610 and isdetected by a second detector 2620. In a particular embodiment, asilicon (Si) detector and a gallium arsenide (GaAs) detector are used.The Si detector is placed on top of the GaAs detector so that light mustpass through the Si detector before reaching the GaAs detector. The Sidetector can be placed directly on top of the GaAs detector or the Siand GaAs detector can be separated by some other medium, such as atransparent medium or air. In another particular embodiment, a germaniumdetector is used instead of the GaAs detector. Advantageously, thestacked detector arrangement minimizes error caused by pathlengthdifferences as compared with the adjacent detector embodiment.

Finger Clip

FIG. 27 illustrates a finger clip embodiment 2700 of a physiologicalsensor attachment assembly. The finger clip 2700 is configured toremovably attach an emitter assembly 500 (FIG. 6) and detector assembly2400 (FIG. 24), interconnected by a flex circuit assembly 1900, to afingertip. The finger clip 2700 has an emitter shell 3800, an emitterpad 3000, a detector pad 2800 and a detector shell 3900. The emittershell 3800 and the detector shell 3900 are rotatably connected and urgedtogether by the spring assembly 3500. The emitter pad 3000 is fixedlyretained by the emitter shell. The emitter assembly 500 (FIG. 6) ismounted proximate the emitter pad 3000 and adapted to transmit opticalradiation having a plurality of wavelengths into fingertip tissue. Thedetector pad 2800 is fixedly retained by the detector shell 3900. Thedetector assembly 3500 is mounted proximate the detector pad 2800 andadapted to receive the optical radiation after attenuation by fingertiptissue.

FIG. 28 illustrates a detector pad 2800 advantageously configured toposition and comfortably maintain a fingertip relative to a detectorassembly for accurate sensor measurements. In particular, the detectorpad has fingertip positioning features including a guide 2810, a contour2820 and a stop 2830. The guide 2810 is raised from the pad surface 2803and narrows as the guide 2810 extends from a first end 2801 to a secondend 2802 so as to increasingly conform to a fingertip as a fingertip isinserted along the pad surface 2803 from the first end 2801. The contour2820 has an indentation defined along the pad surface 2803 generallyshaped to conform to a fingertip positioned over a detector aperture2840 located within the contour 2820. The stop 2830 is raised from thepad surface 2803 so as to block the end of a finger from insertingbeyond the second end 2802. FIGS. 29A-B illustrate detector padembodiments 3100, 3400 each having a guide 2810, a contour 2820 and astop 2830, described in further detail with respect to FIGS. 31 and 34,respectively.

FIGS. 30A-H illustrate an emitter pad 3000 having emitter pad flaps3010, an emitter window 3020, mounting pins 3030, an emitter assemblycavity 3040, isolation notches 3050, a flex circuit notch 3070 and acable notch 3080. The emitter pad flaps 3010 overlap with detector padflaps 3110 (FIGS. 31A-H) to block ambient light. The emitter window 3020provides an optical path from the emitter array 700 (FIG. 8) to a tissuesite. The mounting pins 3030 accommodate apertures in the flex circuitmounting ears 2214 (FIG. 22), and the cavity 3040 accommodates theemitter assembly 500 (FIG. 21), Isolation notches 3050 mechanicallydecouple the shell attachment 3060 from the remainder of the emitter pad3000. The flex circuit notch 3070 accommodates the flex circuit tail2206 (FIG. 22) routed to the detector pad 3100 (FIGS. 31A-H). The cablenotch 3080 accommodates the sensor cable 4400 (FIGS. 44A-B). FIGS. 33A-Hillustrate an alternative slim finger emitter pad 3300 embodiment.

FIGS. 31A-H illustrate a detector pad 3100 having detector pad flaps3110, a shoe box cavity 3120 and isolation notches 3150. The detectorpad flaps 3110 overlap with emitter pad flaps 3010 (FIGS. 30A-H),interleaving to block ambient light. The shoe box cavity 3120accommodates a shoe box 3200 (FIG. 32A-H) described below. Isolationnotches 3150 mechanically decouple the attachment points 3160 from theremainder of the detector pad 3100. FIGS. 34A-H illustrate analternative slim finger detector pad 3400 embodiment.

FIGS. 32A-H illustrate a shoe box 3200 that accommodates the detectorassembly 2400 (FIG. 24). A detector window 3210 provides an optical pathfrom a tissue site to the detector 2410 (FIG. 24). A flex circuit notch3220 accommodates the flex circuit tail 2206 (FIG. 22) routed from theemitter pad 3000 (FIGS. 30A-H). In one embodiment, the shoe box 3200 iscolored black or other substantially light absorbing color and theemitter pad 3000 and detector pad 3100 are each colored white or othersubstantially light reflecting color.

FIGS. 35-37 illustrate a spring assembly 3500 having a spring 3600configured to urge together an emitter shell 3800 (FIG. 46) and adetector shell 3900. The detector shell is rotatably connected to theemitter shell. The spring is disposed between the shells 3800, 3900 andadapted to create a pivot point along a finger gripped between theshells that is substantially behind the fingertip. This advantageouslyallows the shell hinge 3810, 3910 (FIGS. 38-39) to expand so as todistribute finger clip force along the inserted finger, comfortablykeeping the fingertip in position over the detector without excessiveforce.

As shown in FIGS. 36A-C, the spring 3600 has coils 3610, an emittershell leg 3620 and a detector shell leg 3630. The emitter shell leg 3620presses against the emitter shell 3800 (FIGS. 38A-D) proximate a grip3820 (FIGS. 38A-D). The detector shell legs 3630 extend along thedetector shell 3900 (FIGS. 39A-D) to a spring plate 3700 (FIGS. 37A-D)attachment point. The coil 3610 is secured by hinge pins 410 (FIG. 46)and is configured to wind as the finger clip is opened, reducing itsdiameter and stress accordingly.

As shown in FIGS. 37A-D the spring plate 3700 has attachment apertures3710, spring leg slots 3720, and a shelf 3730. The attachment apertures3710 accept corresponding shell posts 3930 (FIGS. 39A-D) so as to securethe spring plate 3700 to the detector shell 3900 (FIG. 39A-D). Springlegs 3630 (FIG. 36A-C) are slidably anchored to the detector shell 3900(FIG. 39A-D) by the shelf 3730, advantageously allowing the combinationof spring 3600, shells 3800, 3900 and hinges 3810, 3910 to adjust tovarious finger sizes and shapes.

FIGS. 38-39 illustrate the emitter and detector shells 3800, 3900,respectively, having hinges 3810, 3910 and grips 3820, 3920, Hingeapertures 3812, 3912 accept hinge pins 410 (FIG. 46) so as to create afinger clip. The detector shell hinge aperture 3912 is elongated,allowing the hinge to expand to accommodate a finger.

Monitor and Sensor

FIG. 40 illustrates a monitor 100 and a corresponding sensor assembly200, as described generally with respect to FIGS. 1-3, above. The sensorassembly 200 has a sensor 400 and a sensor cable 4400. The sensor 400houses an emitter assembly 500 having emitters responsive to driverswithin a sensor controller 4500 so as to transmit optical radiation intoa tissue site. The sensor 400 also houses a detector assembly 2400 thatprovides a sensor signal 2500 responsive to the optical radiation aftertissue attenuation. The sensor signal 2500 is filtered, amplified,sampled and digitized by the front-end 4030 and input to a DSP (digitalsignal processor) 4040, which also commands the sensor controller 4500.The sensor cable 4400 electrically communicates drive signals from thesensor controller 4500 to the emitter assembly 500 and a sensor signal2500 from the detector assembly 2400 to the front-end 4030. The sensorcable 4400 has a monitor connector 210 that plugs into a monitor sensorport 110.

In one embodiment, the monitor 100 also has a reader 4020 capable ofobtaining information from an information element (IE) in the sensorassembly 200 and transferring that information to the DSP 4040, toanother processor or component within the monitor 100, or to an externalcomponent or device that is at least temporarily in communication withthe monitor 100. In an alternative embodiment, the reader function isincorporated within the DSP 4040, utilizing one or more of DSP I/O, ADC,DAC features and corresponding processing routines, as examples.

In one embodiment, the monitor connector 210 houses the informationelement 4000, which may be a memory device or other active or passiveelectrical component. In a particular embodiment, the informationelement 4000 is an EPROM, or other programmable memory, or an EEPROM, orother reprogrammable memory, or both. In an alternative embodiment, theinformation element 4000 is housed within the sensor 400, or aninformation element 4000 is housed within both the monitor connector4000 and the sensor 400. In yet another embodiment, the emitter assembly500 has an information element 4000, which is read in response to one ormore drive signals from the sensor controller 4500, as described withrespect to FIGS. 41-43, below. In a further embodiment, a memoryinformation element is incorporated into the emitter array 700 (FIG. 8)and has characterization information relating to the LEDs 801 (FIG. 8).In one advantageous embodiment, trend data relating to slowly varyingparameters, such as perfusion index, HbCO or METHb, to name a few, arestored in an IE memory device, such as EEPROM.

Back-to-Back LEDs

FIGS. 41-43 illustrate alternative sensor embodiments. A sensorcontroller 4500 configured to activate an emitter array 700 (FIG. 7)arranged in an electrical grid, is described with respect to FIG. 7,above. Advantageously, a sensor controller 4500 so configured is alsocapable of driving a conventional two-wavelength (red and IR) sensor4100 having back-to-back LEDs 4110, 4120 or an information element 4300or both.

FIG. 41A illustrates a sensor 4100 having an electrical grid 4130configured to activate light emitting sources by addressing at least onerow conductor and at least one column conductor. A first LED 4110 and asecond LED 4120 are configured in a back-to-back arrangement so that afirst contact 4152 is connected to a first LED 4110 cathode and a secondLED 4120 anode and a second contact 4154 is connected to a first LED4110 anode and a second LED 4120 cathode. The first contact 4152 is incommunications with a first row conductor 4132 and a first columnconductor 4134. The second contact is in communications with a secondrow conductor 4136 and a second column conductor 4138. The first LED4110 is activated by addressing the first row conductor 4132 and thesecond column conductor 4138. The second LED 4120 is activated byaddressing the second row conductor 4136 and the first column conductor4134.

FIG. 41B illustrates a sensor cable 4400 embodiment capable ofcommunicating signals between a monitor 100 and a sensor 4100. The cable4400 has a first row input 4132, a first column input 4134, a second rowinput 4136 and a second column input 4138. A first output 4152 combinesthe first row input 4132 and the first column input 4134. A secondoutput 4154 combines a second row input 4136 and second column input4138.

FIG. 41C illustrates a monitor 100 capable of communicating drivesignals to a sensor 4100. The monitor 4400 has a first row signal 4132,a first column signal 4134, a second row signal 4136 and a second columnsignal 4138. A first output signal 4152 combines the first row signal4132 and the first column signal 4134. A second output signal 4154combines a second row signal 4136 and second column signal 4138.

Information Elements

FIGS. 42-43 illustrate information element 4200-4300 embodiments incommunications with emitter array drivers configured to activate lightemitters connected in an electrical grid. The information elements areconfigured to provide information as DC values, AC values or acombination of DC and AC values in response corresponding DC, AC orcombination DC and AC electrical grid drive signals. FIG. 42 illustratesinformation element embodiment 4200 advantageously driven directly by anelectrical grid having rows 710 and columns 720. In particular, theinformation element 4200 has a series connected resistor R₂ 4210 anddiode 4220 connected between a row line 710 and a column line 720 of anelectrical grid. In this manner, the resistor R₂ value can be read in asimilar manner that LEDs 810 (FIG. 8) are activated. The diode 4220 isoriented, e.g. anode to row and cathode to column as the LEDs so as toprevent parasitic currents from unwanted activation of LEDs 810 (FIG.8).

FIGS. 43A-C illustrate other embodiments where the value of R₁ is readwith a DC grid drive current and a corresponding grid output voltagelevel. In other particular embodiments, the combined values of R₁, R₂and C or, alternatively, R₁, R₂ and L are read with a varying (AC) griddrive currents and a corresponding grid output voltage waveform. As oneexample, a step in grid drive current is used to determine componentvalues from the time constant of a corresponding rise in grid voltage.As another example, a sinusoidal grid drive current is used to determinecomponent values from the magnitude or phase or both of a correspondingsinusoidal grid voltage. The component values determined by DC or ACelectrical grid drive currents can represent sensor types, authorizedsuppliers or manufacturers, emitter wavelengths among others. Further, adiode D (FIG. 43C) can be used to provide one information elementreading R₁ at one drive level or polarity and another informationelement reading, combining R₁ and R₂, at a second drive level orpolarity, i.e. when the diode is forward biased.

Passive information element 4300 embodiments may include any of variouscombinations of resistors, capacitors or inductors connected in seriesand parallel, for example. Other information element 4300 embodimentsconnected to an electrical grid and read utilizing emitter array driversincorporate other passive components, active components or memorycomponents, alone or in combination, including transistor networks,PROMs, ROMs, EPROMs, EEPROMs, gate arrays and PLAs to name a few.

Sensor Cable

FIGS. 44A-B illustrate a sensor cable 4400 having an outer jacket 4410,an outer shield 4420, multiple outer wires 4430, an inner jacket 4440,an inner shield 4450, a conductive polymer 4460 and an inner twistedwire pair 4470. The outer wires 4430 are advantageously configured tocompactly carry multiple drive signals to the emitter array 700 (FIG.7). In one embodiment, there are twelve outer wires 4430 correspondingto four anode drive signals 4501 (FIG. 45), four cathode drive signals4502 (FIG. 45), two thermistor pinouts 1450 (FIG. 15) and two spares.The inner twisted wire pair 4470 corresponds to the sensor signal 2500(FIG. 25) and is extruded within the conductive polymer 4460 so as toreduce triboelectric noise. The shields 4420, 4450 and the twisted pair4470 boost EMI and crosstalk immunity for the sensor signal 2500 (FIG.25).

Controller

FIG. 45 illustrates a sensor controller 4500 located in the monitor 100(FIG. 1) and configured to provide anode drive signals 4501 and cathodedrive signals 4502 to the emitter array 700 (FIG. 7). The DSP (digitalsignal processor) 4040, which performs signal processing functions forthe monitor, also provides commands 4042 to the sensor controller 4500.These commands determine drive signal 4501, 4502 levels and timing. Thesensor controller 4500 has a command register 4510, an anode selector4520, anode drivers 4530, current DACs (digital-to-analog converters)4540, a current multiplexer 4550, cathode drivers 4560, a current meter4570 and a current limiter 4580. The command register 4510 providescontrol signals responsive to the DSP commands 4042. In one embodiment,the command register 4510 is a shift register that loads serial commanddata 4042 from the DSP 4040 and synchronously sets output bits thatselect or enable various functions within the sensor controller 4500, asdescribed below.

As shown in FIG. 45, the anode selector 4520 is responsive to anodeselect 4516 inputs from the command register 4510 that determine whichemitter array row 810 (FIG. 8) is active. Accordingly, the anodeselector 4520 sets one of the anode on 4522 outputs to the anode drivers4530, which pulls up to Vcc one of the anode outputs 4501 to the emitterarray 700 (FIG. 8).

Also shown in FIG. 45, the current DACs 4540 are responsive to commandregister data 4519 that determines the currents through each emitterarray column 820 (FIG. 8). In one embodiment, there are four, 12-bitDACs associated with each emitter array column 820 (FIG. 8), sixteenDACs in total. That is, there are four DAC outputs 4542 associated witheach emitter array column 820 (FIG. 8) corresponding to the currentsassociated with each row 810 (FIG. 8) along that column 820 (FIG. 8). Ina particular embodiment, all sixteen DACs 4540 are organized as a singleshift register, and the command register 4510 serially clocks DAC data4519 into the DACs 4540. A current multiplexer 4550 is responsive tocathode on 4518 inputs from the command register 4510 and anode on 4522inputs from the anode selector 4520 so as to convert the appropriate DACoutputs 4542 to current set 4552 inputs to the cathode drivers 4560. Thecathode drivers 4560 are responsive to the current set 4552 inputs topull down to ground one to four of the cathode outputs 4502 to theemitter array 700 (FIG. 8).

The current meter 4570 outputs a current measure 4572 that indicates thetotal LED current driving the emitter array 700 (FIG. 8). The currentlimiter 4580 is responsive to the current measure 4572 and limitsspecified by the command register 4510 so as to prevent excessive powerdissipation by the emitter array 700 (FIG. 8). The current limiter 4580provides an enable 4582 output to the anode selector 4520. A Hi Limit4512 input specifies the higher of two preset current limits. Thecurrent limiter 4580 latches the enable 4582 output in an off conditionwhen the current limit is exceeded, disabling the anode selector 4520. Atrip reset 4514 input resets the enable 4582 output to re-enable theanode selector 4520.

Sensor Assembly

As shown in FIG. 46, the sensor 400 has an emitter shell 3800, anemitter pad 3000, a flex circuit assembly 2200, a detector pad 3100 anda detector shell 3900. A sensor cable 4400 attaches to the flex circuitassembly 2200, which includes a flex circuit 2100, an emitter assembly500 and a detector assembly 2400. The portion of the flex circuitassembly 2200 having the sensor cable 4400 attachment and emitterassembly 500 is housed by the emitter shell 3800 and emitter pad 3000.The portion of the flex circuit assembly 2200 having the detectorassembly 2400 is housed by the detector shell 3900 and detector pad3100. In particular, the detector assembly 2400 inserts into a shoe3200, and the shoe 3200 inserts into the detector pad 3100. The emittershell 3800 and detector shell 3900 are fastened by and rotate abouthinge pins 410, which insert through coils of a spring 3600. The spring3600 is held to the detector shell 3900 with a spring plate 3700. Afinger stop 450 attaches to the detector shell. In one embodiment, asilicon adhesive 420 is used to attach the pads 3000, 3100 to the shells3800, 3900, a silicon potting compound 430 is used to secure the emitterand detector assemblies 500, 2400 within the pads 3000, 3100, and acyanoacrylic adhesive 440 secures the sensor cable 4400 to the emittershell 3800.

A multiple wavelength sensor has been disclosed in detail in connectionwith various embodiments. These embodiments are disclosed by way ofexamples only and are not to limit the scope of the claims that follow.One of ordinary skill in art will appreciate many variations andmodifications.

What is claimed is:
 1. A physiological sensor comprising: a plurality oflight emitting sources, each light emitting source activated byaddressing at least one of a plurality of rows and at least one of aplurality of columns of an electrical grid, the light emitting sourcescapable of transmitting light of a plurality of wavelengths; and adetector responsive to the transmitted light after attenuation by bodytissue.